The family of 3M Low Density Void Fillers is based on a epoxy resin technology with low density for room- , or high temperature curing solutions.
3M Scotch-Weld Low Density Void Filler are curable materials based on epoxy chemistry, designed for void-filling,
edge-sealing, corner- and local reinforcement of aerospace honeycomb sandwich structures. The edge fillers are
pumpable, non-sag, paste like fillers that cure to a low density material with high compressive strength and excellent chemical resistance. Some of the materials meet J.A.R./F.A.R. 25.853 (a) and Airbus Directive (ABD) 0031.
The family of 3M Low Density Void Fillers is based on a epoxy resin technology with low density for room- , or high temperature curing solutions.
